Instructor: Richard Crisp, Etron Technology America
Level: Intermediate
Prerequisites: Helpful to be familiar with electronic circuit design and analysis

Benefits:
This course enables the attendee to:

• Explain how CMOS image sensors convert light to images
• List CMOS image sensor architectures
• Give examples of noise sources in images and options for mitigation
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• Dissect an imaging system's key performance parameters by measurement
• Explain important differences in image sensor manufacturing vs logic ICs
• Break down the steps of system design: selecting sensor architecture, pixel size, pixel count and optics

Course Description:
This course provides an introductory- to intermediate-level overview of the theory and operation of CCD and CMOS image sensors with system design and application considerations in a half-day course.

Topics include:

• Basics of image capture/formation: photon capture, charge generation, movement and measurement.
• Sensor architectures & operation, CCDs: full frame, frame transfer, interline and CMOS: Rolling Shutter, Progressive Scan and Global Snap Shutter. Frontside vs. backside illumination. Operational differences between CCD and CMOS sensors.
• Primary noise sources: Signal shot noise, fixed pattern noise, thermal noise sources (dark shot noise, dark fixed pattern noise) and read noise plus CMOS random telegraph noise and image lag.
• Sensor/Camera performance characterization and noise and management: Quantum efficiency, Fe55 Soft X-ray characterization / sensor diffusion MTF assessment/optimization, photon transfer analysis, SNR optimization.
• Sensor manufacturing: die size vs. lithography type vs wafer size.
• Substrate electrical properties, backside illumination fabrication differences, laminated stacked die architectures.

Intended Audience: Imaging engineers, scientists, camera designers, those involved in sale and support of image sensors and cameras using same

Richard D. Crisp is currently vice president of new technology development and chief scientist for Etron America where he is engaged in developing low-cost DRAM architectures for miniaturized imaging systems. Crisp has designed imaging systems, CPUS, memories, and miniaturized semiconductor packaging. He has worked for Intel, Motorola, MIPS, Rambus, Tessera, and Etron, and has received more than 80 patents for his work. He was a member of the ISSCC Program Committee from 1991-2000, sering in various chair positions during that time. Crisp has published many peer-reviewed papers in journals and conferences such as the ISSCC, IEEE JSSC, EI, ISMP, and ICEP, including recent work in the area of using Photon Transfer methods to quantify thermally-dependent image lag in cooled scientific imaging systems. Crisp is also an astro-photographer with many published images including with OSA, Smithsonian, and Space Telescope Science Institute.