Important Dates

Call for Presentations
 » JIST-first Submission
1 March 2018
      (w/paper in proceedings)
 » Standard Submission
16 April 2018
      (w/paper in proceedings)
Final Manuscripts Due
5 July 2018
Hotel Reservations
28 July 2018
Early Registration Ends
26 August 2018
Conference Begins
23 September 2018

Co-sponsored By

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Week At-a-Glance

Sunday, Sept. 23
  • Short Courses
  • Welcome Reception at Westin Historic Beergarden & Fountain
Monday, Sept. 24
Tuesday, Sept. 25
Wednesday, Sept. 26
Thursday, Sept. 27

Technical Program

Monday September 24, 2018


opening Keynote

Session Chair: Wolfgang Schmidt, Felix Schoeller Group (Germany)

9:00 – 10:00

Organic Semiconductors: From Vacuum Deposition to Printing, Karl Leo, Technische Universität Dresden (Germany)

Organic semiconductors consisting mostly of carbon are currently intensively investigated for electronic and optoelectronic applications. They offer key advantages, such as flexibility, easy recycling, low cost, and many more. In the first part of this talk, I will discuss some of the recent progress on devices such as highly efficient OLED, solar cells, transistors, and sensors and discuss the many novel applications these “soft” electronic devices” offer. In the second part, I will address manufacturing issues and discuss how the field of organic electronics will move from the current vacuum techniques to low-cost printing.


Session Chair: Ingo Reinhold, XaarJet Ltd. (Sweden)

14:00 – 14:50

Printing Future Electronic Devices With Organic Semiconducting Materials,Mark James, Merck Chemicals Ltd. (UK)

Merck has been actively researching organic electronic materials since before 2000, with the objectives to develop products that enable mass production of electronic devices with new functionality not readily obtainable using existing silicon technologies. Multi-disciplinary innovation is required to develop many interrelated materials and processes in parallel to realize these step-change technologies. This talk discusses this process as well as the developement of solution processable and printable, functional material sets, covering the technologies of OLED, OTFT, OPV, and OPD.

How the co-development of polymeric organic semiconductors, passive materials, and formulations with process optimisation enable the printing of high performance OTFT backplane arrays, with charge carrier mobility greater than 2 cm2/Vs, suitable for the mass production of printed flexible displays and sensors is also presented.

Technology Networking Event Print4Fab Speed Networking

Moderator: Ingo Reinhold, XaarJet Ltd. (Sweden)

17:20 – 18:20


Ink/Substrate Interaction

Session Chair: TBA

10:20 – 17:20

Session sponsored by Ricoh.

Functional Paper for Sublimation Printing and Transfer (Focal), Michael Jocher, Sebastian Scholz, Emanuele Martorana, Dirk Hörnschemeyer, Georg Bieniek, and Knut Hornig, Schoeller Technocell GmbH & Co. KG (Germany)

Development of an Optimized Nonwoven Substrate for Digital Printed Wallpaper, Knut Hornig, Michael Avermann, Dieter Goeppert, and Dieter Kaumkoetter, Schoeller Technocell GmbH & Co. KG (Germany)

Study on Printing Performance of Degradable Polylactic Acid Film Packaging Material, Hongge Guo, Qilu University of Technology (China)

Basic Study on Effects of Water Content on Equivalent Thermal Conductivity of Thermal Printing Paper, Takashi Fukue1, Hirotoshi Terao2, Koichi Hirose3, Tomoko Wauke2, Hisashi Hoshino2, and Koji Sato3; 1Kanazawa Institute of Technology, 2Alps Electric Co., Ltd., and 3Iwate University (Japan)

Tall Oil Rosin: A Substitute for Gum Rosin in Development of Offset Printing Ink (Interactive Preview), Mahuya Biswas and Srabana Kundu, DIC India Limited, and Shankhya Debnath, Regional Institute of Printing Technology (India)

Facile Strategy for the Fabrication of Superhydrophobic Paper with Superior Stability Against Deformations (Interactive Preview), Qing Wang1,2, Guangxue Chen1,2, Zhaohui Yu1, Linyi Chen1, Rui Guo1, and Min Li1; 1Shenzhen YUTO Packaging Technology Co., Ltd. and 2South China University of Technology (China)

Evaluating Line Qualities Attributes of Specialty Inks on Photographic Substrates for Inkjet,Mihir Choudhari, Shu Chang, and Christine Heusner, Rochester Institute of Technology (US)

Stability of Line Structures Produced by Inkjet Printing, Jinxin Yang and Brian Derby, University of Manchester (UK)

New White Pigment Ink: Correlation between Structure of Inorganic Particles and White Opacity, Tomohiro Hirade, Ricoh Co., Ltd. (Japan)

A Study on the Coupling Analysis between Structural and Particles for Toner Leakage Prediction, Yunki You, Jungro Seo, Taehan Kim, HP Printing Korea; Cheol O. Ahn, Metariver Technology; and  Yooseok Kim Taesung S&E (South Korea)

Water based Green Lithography, Haihua Zhou and Yanlin Song, Chinese Academy of Sciences (China)


Moderator: Ingo Reinhold, XaarJet
Ltd. (Sweden)

17:20 – 18:20

Join colleagues in a fast and fun session that helps you learn about the technical expertise and interests of others attending the conference.


Printed Functional Devices

Session Chair: TBA

10:20 – 18:20

Printed Flexible Pressure Sensor for Robot Skin (Focal), Atsushi Nakajima1,2, Toru Miyoshi1, Kenji Kohiro1,3, Motoshi Itagaki1, Toshihide Kamata1,4, and Tetsuo Urabe1,4; 1Japan Advanced Printed Electronics Reseach Asociation (JAPERA), 2Konica Minolta, Inc., 3Sumitomo Chemical Co., Ltd., and 4The National Insttitute of Advanced Industrial Sciense and Technology (AIST) (Japan)

Fabrication and Characterization of Different Sensors on Paper as a Flexible Substrate, Goran Stojanovic and Tijana Kojic, University of Novi Sad (Serbia)

A Study of the Potentiality of Inkjet Printing Technique for the Fabrication of Organic Metal-Insulator-Semiconductor Rectifying Diodes, Silvia Conti1, Carme Martinez-Domingo1,2, and Eloi Ramon1; 1Instituto de Microelectrónica de Barcelona and 2Universitat Autònoma de Barcelona (UAB) (Spain)

Development and Evaluation of Inkjet Printed TFTs based on Architecture, Materials, and Process Deposition for Better Suitability to Flexible Electronics, Kalyan Mitra1, Sunil Kapadia1, Maxim Polomoshnov1, Ralf Zichner2, and Reinhard Baumann1,2; 1Technische Universität Chemnitz and 2Fraunhofer Institute for Electronic Nano Systems (Germany)

Preparation of Highly Conductive Poly (3,4-ethylenedioxythiophene) Flexible Thin Films Electrode (Interactive Preview), Xiujie Hu, Chinese Academy of Sciences (China)

Special Pattern Design based on Printed Electronics (Interactive Preview), Yingmei Zhou, Shanghai Publishing and Printing College (China)

Preparation of Graphene/Cellulose Composite Conductive Films (Interactive Preview), Fuqiang Chu, Qilu University of Technology (China)

Flexible Circuits Fabricated through Inkjet Printing (Interactive Preview), Xingye Zhang, Chinese Academy of Sciences (China)

Inkjet Printing for MEMS Device, Matti Mäntysalo, Mika-Matti Laurila, and Behnam Khorramdel, Tampere University of Technology (Finland)

Fabrication of Large Area Inkjet-Printed OTFTs on Flexible Substrates: Manufacturing Challenges and Electronic Design Constraints, Eloi Ramon, Institute of Microelectronics of Barcelona IMB-CNM (CSIC) and Universitat Autònoma de Barcelona (UAB) (Spain)

Micro-Reactive Inkjet Printing of Polyaniline, Mei Ying Teo, Logan Stuart, Kean Aw, and Jonathan Stringer, University of Auckland (New Zealand)

PANI-Graphene Nanocomposite as an Active Material for Large-Scale Low-Cost Electrochemical Double Layer Capacitors, Rekha Singh1, Thomas Weissbach2, Tino Zillger2, Anil Kumar1, and Arved Hübler2; 1Indian Institute of Technology Bombay (IITB) (India) and 2Chemnitz University of Technology (Germany)

Flexible High-Performance Metallic Interconnects Prepared by Innovative Diode Laser Array Treatment of Inkjet-Printed Layers, Mykola Vinnichenko1, Marco Fritsch1, Junchen Xiao1, Denys Makarov2, Tetiana Voitsekhivska2, Viktar Sauchuk1, and Mihails Kusnezoff1; 1Fraunhofer Institute for Ceramic Technologies and Systems IKTS and 2Helmholtz-Zentrum Dresden-Rossendorf (Germany)

Laser Sintering of Copper Oxide Nanoparticles Ink, Md. Khalilur Rahman1,2, Zhao Lu1, and Kye Si Kwon1; 1Soonchunhyang University (South Korea) and 2Comilla University (Bangladesh)

JIST-FIRST Process Development of Large Area R2R Printing and Sintering of Conductive Patterns by Inkjet and Infra-Red Technologies Tailored for Printed Electronics,Kalyan Mitra1, Sunil Kapadia2, Melinda Hartwig2, Enrico Sowade3, Zhenxing Xu4, Ralf Zichner1, and Reinhard Baumann2; 1Fraunhofer Institute for Electronic Nanosystems ENAS, 2Technische Universität Chemnitz, 3Zschimmer & Schwarz, and 4PadaLuma Ink-Jet-Solutions GmbH & Co. KG (Germany)

JIST-FIRST Inkjet Printing and Intense Pulsed Light (IPL) Sintering of Multiwall Carbon Nanotubes (MWCNTs) for Sensor Applications, Dana Mitra, Tatiana Zubkova, Carina Gerlach, Dominique Miesel, Olfa Kanoun, Heinrich Lang, and Reinhard Baumann, Technische Universität Chemnitz (Germany)


 International Symposium on Technologies for Digital Photo fulfillment 2018

Program will be released in late July via the conference webpage.

Tuesday September 25, 2018

All Tracks

Tuesday Keynote and awards

Session Chair:   Norio Nagayama, Ricoh Co., Ltd. (Japan)        

9:00 – 10:00

Keynote: Electronic Skins Connecting Cyberspace and Human, Takao Someya, University of Tokyo (Japan)

Wearable electronics are expected to open up a new class of applications ranging from health-monitoring, motion-capturing, human-machine interfaces, and new IT fashion. In order to expand emerging applications of wearable technologies, printed flexible biomedical sensors have attracted much attention recently. To minimize the discomfort of wearing sensors, it is highly desirable to use soft electronic materials particularly for devices that come directly into contact with the skin and/or biological tissues. In this regard, electronics manufactured on thin polymeric films, elastomeric and textile substrates by printing are very attractive. This keynote reviews recent progresses of wearables and artificial electronic skins (E-skins) from the contexts of high-precision and long-term vital signal monitoring. Furthermore, the issues and the future prospect of wearables and beyond wearables is addressed. 

2018 exhibition

10:00 – 17:30

See exhibits tab for the current list of exhibitors.

interactive paper session/demonstrations/exhibits/Happy Hour

16:00 – 17:30

Invitation to Showcase Your Software and/or Hardware
Printing for Fabrication Demonstration Session

Technology demonstrations by industry and academic participants showcase the latest developments driving next generation printing products.

This popular event provides authors with an additional opportunity to showcase their work. Authors are offered a complimentary half-table on which to display hardware and/or software related to papers presented at the conference (assuming they register by the Demo Session deadline). Non-authors may take advantage of this opportunity for a small fee that covers expenses.

Indicate your interest in demonstrating when you register for the conference.


Digital Textile Printing

Session Chair: TBA

10:20 – 16:00

Digital Textile Printing: Current State and Transformation to Digital Textile Manufacturing (Focal), Ronald Askeland, Howard Doumaux, and Edward Davis, HP Inc. (US)

Inkjet Printing of Textiles – Inkjet Ink Formulations and Further Textile Auxiliaries, Enrico Sowade, Oliver Richter, Peter Oehme, Nora Wetzold, Julia Ahrens, and Andreas Schoenfeld, Zschimmer & Schwarz (Germany)

Synergistic Effect of Pre-Treatment Solution and Inkjet Ink to Control Coloring Characteristics on Fabric, Yoshitaka Miyajima, Takuya Sonoyama, and Hiroshi Kiguchi, Seiko Epson Corporation (Japan)

The Effect of Surface Structure and Performance of Cotton Fabric on the Resolution of Ink-Jet Printing, Zhen Shi, Rui Dan, Longyun Hao, Weichao Chen, Ruyi Xie, and Kuanjun Fang, Qingdao University (China)

Influence of 3D Printing on Physical Properties of Textiles (Focal), Sarah Göbel, Saxon Textile Research Institute (Germany)

Effects of Polyols Solvents on Rheological Properties of Reactive Dye Inks for Textile Digital Inkjet Printing (Interactive Preview), Ruyi Xie, Kuanjun Fang, Weichao Chen, Longyun Hao, and Zhen Shi, Qingdao University (China)

Improved Stability of Disperse Dyes/Polymer Composite Nanospheres for Aqueous Inkjet Inks (Interactive Preview), Yawei Song, Kuanjun Fang, and Weichao Chen, Qingdao University (China)

A Novel Four-Color Dyes/P(St-BA-MAA) Nanosphere Dispersions with High Dye Absorption for Inkjet Inks (Interactive Preview), Kuanjun Fang, Yawei Song, Weichao Chen, Ruyi Xie, and Zhen Shi, Qingdao University (China)

Integrative Digital Manufacturing Approach for Processing Technical Textiles, Frank Siegel, Sarah Göbel, Dirk Wenzel, Falko Schubert, and Sten Döhler, Saxon Textile Research Institute (STFI), and Andreas Böhm, futureTEX Management GmbH (Germany)

Functionalization of Textiles by Screen Printing – Realization of Protective Textiles Against Mechanical Risks,Maren Gültner and Romy Naumann, Saxon Textile Research Institute (Germany), and Dita Krácalová and Jirí Procházka, SINTEX a.s. (Czech Republic)

Printed Hybrid System on Technical Textiles: Battery, Communication Elements, Antennas, Conductive Paths, Carmen Meuser, Andreas Willert, and Ralf Zichner, Fraunhofer Institute for Electronic Nano Systems ENAS (Germany)

Printed Conductive Patterns on Technical Textiles, Christian Zeiner, Technische Universität Chemnitz (Germany)

3D Interactive Previews

New and Unique Hotend for 500°C Range 3D FDM/FFF Usage (Interactive Preview), Jiro Oi, HIT Research Corporation (US)

Study on the Influencing Factors of Printing Speed for Paper-based 3D Printing under Cutting and Bonding Scheme (Interactive Preview), Liuxi He, Shenzhen YUTO Packaging Technology Co., Ltd. (China)

interactive paper session/demonstrations/exhibits/Happy Hour

16:00 – 17:30

Track 2

Printed Electronics: Materials

Session Chair: TBA

10:20 – 13:10

Room Temperature Interconnection of Silicon Solar Cells Using a Liquid Metal (Focal), Dong-Youn Shin and Hae Wook Chung, Pukyong National University, and Hyung-Jun Song, Jeong In Lee, and Gi-Hwan Kang, Korea Institute of Energy Research (South Korea)

Direct Printing of Conductive Metal Lines from Molten Solder Jets via StarJet Technology on Thin, Flexible Polymer Substrates, Zhe Shu1, Björn Gerdes1, Lutz Riegger1, Roland Zengerle1,2, and Peter Koltay1,2; 1Albert-Ludwigs-Universität Freiburg and 2Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. (Germany)

JIST-FIRST Piezoelectric Inkjet Printed Metallic Igniters, Jeffrey Rhoads, Allison Murray, Whitney Novotny, Nikhil Bajaj, I. Gunduz, Steven Sun, and George Chiu, Purdue University (US)

New Developments in Printed Electronics Using Offset Lithography on Paper Substrates, Rakel Herrero, CEMITEC (Fundación Cetena) (Spain)

Functional Integration in Fiber Reinforced Plastics (FRP) by use of Digital Printing (Focal), Volker Zöllmer, Katharina Haag, Jonas Deitschun, and Dirk Godlinski, Fraunhofer-Institute for Manufacturing Technology and Advanced Materials IFAM (Germany)

Generalized Computational Halftone Image Formation (Interactive Preview), Chunghui Kuo, Eastman Kodak Company (US)

Spectral Reconstruction of Chinese Painting based on Manifold Learning Method in Graphic Communication (Interactive Preview), Meiqi Lin, Qilu University of Technology (China)

Research on Several Models of Computer Color Matching for Flexographic Printing based on Improved BP Neural Network (Interactive Preview), Xiaozhou Li, Jingqiang Jia, Mingming Cui, and Yu Liu, Qilu University of Technology (China)

Lab2Fab Challenges

Session Chair: TBA

14:30 – 16:00

A Novel Process of Automated Waveform Optimization, Kyle Pucci, ImageXpert Inc. (US)

Planning and Integration of a Non-Standard Inkjet Print Process into an Industrial Manufacturing Line—View of an Integrator, Uwe Buerklin, Thieme GmbH & Co KG (Germany)

Substrate Transport for Production at Variable Process Speeds, Robert Thieme1, Thomas Oberle1, Martin Porschen1,2, and Christoph Ziegler1; 1GT+W GmbH and 2TU Darmstadt (Germany)

Advanced Laser-based Manufacturing for Digital Fabrication (Focal), Tino Petsch, 3D-Micromac AG (Germany)

interactive paper session/demonstrations/exhibits/Happy Hour

16:00 – 17:30

Track 3


Session Chair: TBA

10:20 – 14:50

Personalized Medicine and 2D Drug Printing Using Industrial Inkjet Printing Technology (Focal), Patrizia Ghiotti, UCB S.A. (Belgium), and Massimo Bresciani and Wen-Kai Hsiao, Research Center Pharmaceutical Engineering GmbH (Austria)

Industrial Inkjet Printing for On-Demand Manufacturing of Film-in-Capsule Dosage Forms, Wen-Kai Hsiao1, Diogo Lopes1, Laura Hauser2, Thomas Wutscher1, Amrit Paudel1, Massimo Bresciani1, Johannes Khinast1, and Andreas Zimmer2; 1Research Center Pharmaceutical Engineering and 2University of Graz (Austria)

Digital Printing for Healthcare Solutions, Hannah O’Brien and Alan Hudd, Alchemie Technology Ltd. (UK)

Inkjet Printing Platforms for Antibody- and DNA-based Pathogen Detection, Min Zhao, Purdue University (US)

Bioink Development and Bioprinting Bio-based Matrices (Focal),Kirsten Borchers1,2, Eva Hoch3, Annika Wenz3, Birgit Huber3, Sandra Stier4, Lisa Sewald2, Christiane Claaßen2, Petra Kluger3, and Achim Weber1,2; 1Fraunhofer-Institute for Interfacial Engineering and Biotechnology IGB, 2University of Stuttgart, and 3Formerly: University of Stuttgart, 4Formerly:Fraunhofer-Institut for Interfacial Engineering and Biotechnology IGB (Germany)

Personalising Medicines by Drug Printing, Maren Preis, Abo Akademi University (Finland)

Real World Smart Packaging for Pharmaceuticals, Michael Petersen, Information Mediary Corp. (Canada)

IP & Standards

Session Chair:  TBA

14:50 – 16:00

International Standards Enabling Printed Electronics for Wearables, Alan Hodgson,, Alan Hodgson Consulting Ltd. and University of Manchester (UK)

Overview of Standardization Activities for Inkjet Additive Manufacturing (within IEC TC 119 Printed Electronics), Kei Hyodo1,2 and Shinri Sakai2; 1Yuasa System Co. Ltd. and 2Yamagata University (Japan)

Basics of Standard Essential Patents and Licensing Them, Scott Slomowitz and Gary Greene, Caesar Rivise, PC (US) with extended discussion time

interactive paper session/demonstrations/exhibits/Happy Hour

16:00 – 17:30

Wednesday September 26, 2018

All Tracks

Wednesday Morning KEYNOTE and AWARDS

Session Chair:  James Stasiak, HP Inc. (USA)            

9:00 – 10:00

Advances in Additive Manufacturing: The Evolution of HP Inc.’s Jet FusionTM 3D Printing Technology, David Claramunt, HP Inc. (US)

Recent advances and innovations in 3D printing, digital fabrication, and additive manufacturing methods are disrupting the way we design, develop, manufacture, and commercialize new technologies and products. These disruptions are enabling improved efficiencies on the manufacturing floor and in making the vision of mass customization a reality.  It is clear that the newest industrial revolution is already well underway.  The next phase of the revolution will extend beyond fit, form, and finish and will involve designing and engineering the functionality of the finished part by controlling the fundamental physical properties of the materials digitally, in real time, and at molecular and atomic scales. In this next phase, designers and engineers will be able to select and tune the physical properties of individual voxels as easily as geometric attributes. Leveraging decades of research and expertise in precision mechanics, microfluidics and materials sciences, HP has developed a 3D printing technology that achieves this level of control and is already reinventing the digital fabrication and manufacturing paradigms.  This presentation will provide an overview of the Jet Fusion™ technology, discuss how it has evolved since its introduction in 2016.  The presentation will conclude with a vision of how voxel-scale engineering will help to define the future of 3D printing, additive manufacturing, and digital fabrication. 


Session Chair: 

14:00 – 14:50

Industrial Applications of Inkjet Technologies, Rich Baker, Integrity Industrial Ink Jet Integration LLC (US)

Inkjet is a versatile, precision deposition process, that is increasingly finding utilization in industrial manufacturing of products. These usages range from traditional graphics, labels and date-coding, to more novel applications, such as, deposition of functional fluids (biological, pharmaceutical, electronic, etc.), 3D item fabrication, and the deposition of adhesives and coatings. Using his perspective as president and founder of one of the largest independent inkjet systems integrators in the United States, Baker highlights a few of these novel applications of inkjet, plus explore the challenges and barriers to implementation of inkjet into main stream manufacturing.

Wednesday Coffee Breaks sponsored by

2018 exhibition

10:00 – 16:10

See exhibits tab current list of exhibitors.

Connections for Innovation in Security Printing

The Fabrication Needs of Secured Print

16:30 – 17:30

Session sponsored by  

The secured print industry needs a continuous supply of innovative features. Polymer printing, fluorescents, metallics and smartphone readable features are all in vogue at present and applications in 3D print are emerging. Come and join in the discussion about how we package the Printing for Fabrication technologies to be more accessible to the secured print audience and connect up the supply chain to bring these to market. We’ll discuss features, materials, and ecosystems.


Inkjet Open Forum

Session Chair: _____

17:10 – 17:30

Conference Reception

18:00 – 21:00

Join colleagues for an evening of fun and networking aboard the historic August der Starke Paddle Steamer as we take a cruise and dine on the Elbe River. 


inkjet Processes I

Session Chair: TBA

10:20 – 17:10

Session sponsored by Xaar.

Newly Developed MEMS Printheads for Industrial Inkjet Applications, Kenji Mawatari, Konica Minolta, Inc. (Japan)

Xaar 5601, a Thin Film PZT Si MEMS Inkjet Printhead for Industrial Applications, Ramon Borrell, Xaar plc (UK)

Increased Ink Space with Existing Thermal Inkjet Silicon and Printhead Modules Using Micro Pumping (Focal), James Przybyla, Alex Govyadinov, and Nick McGuinness, HP Inc. (US)

What Determines the Performance Limits of Piezo Inkjet Heads?, Shinri Sakai, Yamagata University (Japan)

Visualization of Ink Fluidity in Inkjet Imaging Process Using Method of Optical Coherence Tomography, Yoshihiro Harada and Masataka Mohri, Ricoh Co., Ltd. (Japan)

JIST-FIRST On Plateau-Rayleigh Instability of a Cylinder of Viscous Liquid, Leonid Pekker, FUJIFILM Dimatix (US)

Higher Order Meniscus Oscillations and Small Droplets, J. Frits Dijksman, University of Twente, and Paul Duineveld, Philips Personal Health (the Netherlands)

Meniscus Motion in Piezo-Drop on Demand Inkjet Printing, Claudio Ravasio, Ioannis Menicou, and Stephen Hoath, Wolfson College Cambridge, and Peter Boltryk and Marko Dorrestijn, Xaar plc (UK)

JIST-FIRST Particle Transport in Microchannels, Leonid Pekker, FUJIFILM Dimatix (US)


Inkjet Open Forum

17:10 – 17:30

 Join colleagues for an open discussion about the inkjet papers presented on Wednesday.

Conference Reception

18:00 – 21:00

Join colleagues for an evening of fun and networking aboard the historic August der Starke Paddle Steamer as we take a cruise and dine on the Elbe River. 


3D Printing

Session Chair: TBA

10:20 – 17:30

Transport of Engineered Nanomaterials in Polyamide Powders, James Stasiak, HP Inc., and Katrina Donovan, Oregon State University (US)

Voxel-Level Materials Science: Selective Mechanical Property and Electronic Property Control within 3D Printed Parts Using Multi Jet Fusion, Kristopher Erickson, Paul Olumbummo, Sterling Chaffins, Aja Hartman, Lihua Zhao, and Howard Tom, HP Inc. (US)

Real-Time X-Ray Visualization of Penetration Dynamics of Ink into Powder Bed for Binder Jetting Process (Focal), Shin Mizutani and Daichi Yamaguchi, Ricoh Co., Ltd., and Takeshi Fujiwara, Masato Yasumoto, and Ryunosuke Kuroda, National Institute of Advanced Industrial Science and Technology (Japan)

3D Printing of Wood—Inkjet Printing of a Lignin based Ink on Cellulose, Mathieu Soutrenon, Gabriel Billato, and Fritz Bircher, iPrint/HEIA-FR and Thomas Geiger, EMPA (Switzerland)

3D Printing with Xenon Flash Lamp, Krzysztof Nauka, Seongsik Chang, Aja Hartman, and Lihua Zhao, HP Inc. (US)

Permanence Testing of 3D-Printed Objects Subjected to Fade Testing with Outdoor Daylight and High-Intensity Fluorescent Illumination and Evaluated with a Multispectral Camera and Image Analysis System, Henry Wilhelm, Wilhelm Imaging Research, Inc. (US) and Ryerson University (Canada)

Development of a Closed-Loop Control System for the Movements of the Extruder and Platform of a FDM 3D Printing System, Alvaro Jose Rojas Arciniegas and Manuela Cerón Viveros, Universidad Autonoma de Occidente (Colombia)

High-Resolution 3D Printing at the Tip of Optical Fibres, Richard Caulfield, Saja Aabith, Richard Colchester, Sacha Noimark, Anna David, Ioannis Papakonstantinou, Adrien Desjardins, and Manish Tiwari, University College London (UK)

Additive Manufacturing of Optical Components, Erik Beckert, Falk Kemper, Sophie Sauva, and Maximilian Reif, Fraunhofer IOF (Germany)

Towards 3D Digital Printing of Micro-Electromechanical Systems, Ofer Fogel and Zvi Kotler, Orbotech, and Zeev Zalevsky, Bar-Ilan University (Israel)

Conference Reception

18:00 – 21:00

Join colleagues for an evening of fun and networking aboard the historic August der Starke Paddle Steamer as we take a cruise and dine on the Elbe River. 


Security Printing

Session Chair: TBA

10:20 – 16:30




Session sponsored by  

The Smartphone as a Security Print Inspection Tool, Alan Hodgson, Alan Hodgson Consulting Ltd. (UK), and Robert Ulichney, HP Labs, HP Inc. (US)

Extending the Reach of a Barcode-based Imaging Ecosystem, Matthew Gaubatz and Marie Vans, HP Inc., and Steven Simske, Colorado State University (US)

Authentication of 3D Printed Parts Using 3D Physical Signatures (Focal), Stephen Pollard, Guy Adams, Faisal Azhar, and Fraser Dickin, HP Labs (UK)

Information Embedding in 3D Printed Objects Using Metal-Infused PLA and Reading with Thermography, Piyarat Silapasuphakornwong1, Chaiwuth Sithiwichankit2, and Kazutake Uehira1; 1Kanagawa Institute of Technology (Japan) and 2Chulalongkorn University (Thailand)

Improvements in the Image Quality of Thermally Printed Security Cards, Mark Mizen, HID Global (US)

Stable Inks Containing Upconverting Nanoparticles based on an Oil-in-Water Nanoemulsion, Jon Kellar, South Dakota School of Mines and Technology (US)

Functional Ink Formulation for Individualized Smart Tags, Liisa Hakola, VTT (Finland)


Connections for Innovation in Security Printing

The Fabrication Needs of Secured Print

16:30 – 17:30

Session sponsored by  

The secured print industry needs a continuous supply of innovative features. Polymer printing, fluorescents, metallics and smartphone readable features are all in vogue at present and applications in 3D print are emerging. Come and join in the discussion about how we package the Printing for Fabrication technologies to be more accessible to the secured print audience and connect up the supply chain to bring these to market. We’ll discuss features, materials, and ecosystems.

Thursday September 27, 2018

All Tracks


Session Chair: Reinhard Baumann,Fraunhofer Institute for Electronic Nano Systems ENAS and Technische Universität Chemnitz (Germany), and Ingo Reinhold, XaarJet Ltd. (Sweden

8:45 – 9:40

2018-2020—The Time to Go Industrial with Digital Packaging Production, Berhard Schaaf, Heidelberger Druckmaschinen (Germany)

Due to the automated collection and analysis of user data, the customer approach has become more segment-orientated. As a result, go to the next supermarket and you will see how the variation of products is almost exploding, which has a strong impact on shorter runs and faster production cycles. 

We live in a world where the question is not any longer if digital is the answer for packaging printing. Today the question is how to build a profitable business with it, which technology to select strategically and what to take into account to succeed.

Technology Networking Event

Late Breaking News

Session Chair: TBA

11:40  – 12:40

technology TOURs

13:00 – 18:00


inkjet Processes II

Session Chair: TBA

10:00 – 11:40

Inkjet Printing on Three-Dimensional Freeform Objects, Olivier Bürgy, Raphael Rätz, and Fritz Bircher, iPrint/HEIA-FR (Switzerland)

Direct-to-Shape: Increasing the Throw Distance, Renzo Trip1, Nick Jackson1, Felix Steinchen2, Volker Till2, and Werner Zapka1; 1Xaar plc (Sweden) and 2Till GmbH (Germany)

The Importance of Software in Managing and Maintaining Image Quality and Enabling New Industrial Inkjet Applications, Debbie Thorp, Global Inkjet Systems Ltd. (UK)

Printing of Dielectric and Conductive Patterns on Non-Planar Surfaces Using Dispensing and Inkjet, Robert Thalheim1, Maxim Polomoshnov2, and Ralf Zichner1; 1Fraunhofer ENAS and 2Technische Universität Chemnitz (Germany)


Production Printing

Session Chair: TBA

10:00 – 11:40

Modeling Printing System Relationships based on Weibull Distribution, Nikita Gurudath, Ricoh Americas Corporation (US)

Liquid Ink Development System for Production Printing Using Volatile Carrier Oil and Fine Toners, Nobuyuki Nakayama, Satoshi Tatsuura, Taichi Yamada, Toshihiko Suzuki, Takamaro Yamashita, and Osamu Ide, Fuji Xerox Company, Ltd. (Japan)

Permanent Charge Roller for Indigo Digital Presses, Seongsik Chang, HP Inc. (US)

State-of-the-Art Printing Machine Technology, Takeshi Yoshikawa, Komori Corporation (Japan)


Security Printing II

Session Chair: TBA

10:00 – 11:40 AM


Session sponsored by  

Near-Infrared (NIR)-to-NIR Upconversion Nanocrystals for Security-Printing and Forensic Applications, Stanley May and Aravind Baride, University of South Dakota, and Jeevan Meruga, Jon Kellar, and William Cross, South Dakota School of Mines and Technology (US)

Printing Reflective Features for Security Printing, Rudy Ghosh, NovaCentrix (US)

Intrinsic Signatures for Forensic Identification of SOHO Inkjet Printers, Zhi Li, Wanling Jiang, Daulet Kenzhebalin, and Jan Allebach, Purdue University (US)

An Improved Image Denoising Algorithm in Wavelet Domain, Yingmei Zhou, Shanghai Publishing and Printing College, and Zhongmin Jiang, University of Shanghai Science and Technology (China)

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