ATTENTION: EI 2022 will occur live ONLINE.
The program will include a variety of opportunities to interact with colleagues and presenters live, in formal and informal settings. IS&T is committed to providing the best online experience possible and supporting the community in light of travel/reimbursement restrictions. Join us for EI 2022 . . . submit your work today!
Conference Overview
Solid state optical sensors and solid state cameras have established themselves as the imaging systems of choice for many demanding professional applications such as automotive, space, medical, scientific and industrial applications. The advantages of low-power, low-noise, high-resolution, high-geometric fidelity, broad spectral sensitivity, and extremely high quantum efficiency have led to a number of revolutionary uses. The conference will focus on image sensing topics as listed below, bringing together researchers, scientists, and engineers working in these fields, offering the opportunity for quick publication of their work.
This conference includes paper presentations, panel discussions, and joint sessions with other Electronic Imaging conferences with overlapping interests. We welcome student papers. We recognize excellence by awarding the "Arnaud Darmont Memorial Best Paper Award” to the best draft proceedings manuscript. The 2022 best paper award is sponsored by MDPI (Sensors magazine).
Why we are different:
The conference strives to provide a place of exchange and the opportunity for quick publication of new work in the areas of solid state detectors, solid state cameras, new optical concepts, image processing, and novel applications.
The program features work from both industry and academia, and includes state-of-the-art presentations by invited keynote speakers. It is complimented by topics covered in several of the short courses, as well as plenary sessions, demonstration sessions and poster sessions.
The conference includes a mixture of both tutorial and highly advanced research presentations, so that researchers, students and engineers all can find content that is appropriate to their level of expertise. Some of the conference sessions include overview talks as well as panel discussions that allow for in-depth Q&A interactions with experts in industry and academia.
Being part of the ISS conference also means that attendees may attend other conferences under the Electronic Imaging umbrella that week, and efforts are made to minimize conflicts. Related topics covered in other conferences include image quality, displays, 3D imaging, color, the human visual system, and automotive imaging.
2022 Conference Topics
Image input hardware
- Novel image sensors
- Optics and module
- Depth sensing
Imaging algorithms
- Device calibration
- Image / video artifact corrections
- Enhancement
- Rendering
- Computational photography
- Image fusion
- Sensor fusion
- Photogrammetry
- Depth map estimation and 3-D imaging
Imaging system architecture
- Novel system design and simulation
- Imaging system pipeline
- 3A
- Digital image stabilization
- Image quality and usage experience
Immersive imaging
- 360 surround camera architectures
- Cinematic VR systems
- Digital sense
- Applications
- Challenges and innovative solutions
Deep learning
- Application of machine learning/deep learning approaches toward solving problems related to mobile capture, AR/VR, and general camera image pipelines
Advances in technologies and models
- Innovative devices
- Innovative process and post-process (e.g., 3D integration)
- Advances in alternative technologies (organic, a-Si, etc.)
- Noise analysis and noise reduction
- Advanced/novel image sensor or pixel control circuits
- Advanced/novel defects and noise reduction algorithms
- Color pattern or pixel architectures and color demosaicing and reconstruction techniques
- ADCs
High-end image sensors
- High speed
- Large format
- Ultra low power
- Ultra low noise
- Very high dynamic range
On-chip processing for smarter sensors
- On chip signal or image processing
- Image sensors for 3D imaging
- Bio-inspired image sensor
Challenges associated with event acquisition via:
- 360 and 3D cameras
- Multi-camera networks
- Intelligent robotic cameras
- Fixed point cameras
- Drones (unmanned aerial vehicles)
Image sensors assessment and novel implementations or applications
- Hyperspectral image sensors or camera
- Image sensors for computational imaging
- Image sensors for automotive applications
- Image sensors used in integrated networks (internet of things)
- Image sensors for drones and autonomous vehicles
- Sensor fusion
- Miniature autonomous systems based on image sensors
- Image sensors and imaging systems for medical applications
2022 Special Session
TBA
Awards
Arnaud Darmont Memorial Best Paper Award
Past winners
| 2022 |
Arnaud Darmont Memorial Best Paper
Masahide Goto, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, and Toshiro Hiramoto (NHK Science & Technology Research Laboratories, The University of Tokyo, and National Institute of Advanced Industrial Science and Technology (Japan) for their work on "3-Layer stacked pixel-parallel CMOS image sensors using hybrid bonding of SOI wafers." |
| 2021 |
Arnaud Darmont Memorial Best Paper
Seung-Wook Lee, Seungwon Cha, Dongyoung Jang, Mihye Kim, Haewon Lee, Nakyung Lee, Seonok Kim, Kwanyoung Oh, Daehyung Lee, SeungHan Hong, Hana Lee, Sunghoon Oh, Donghyuk Park, Yitae Kim and JungChak Ahn (Samsung Electronics DS) for their work on "A low-voltage 0.7 μm pixel with 6000 e- full-well capacity for a low-power CMOS image sensor." |
| 2020 |
Arnaud Darmont Memorial Best Paper
Yasuyuki Fujihara, Maasa Murata, Shota Nakayama, Rihito Kuroda, and Shigetoshi Sugawa (Tohoku University) for their work on "An over 120dB dynamic range linear response single exposure CMOS image sensor with two-stage lateral overflow integration trench capacitors." |
| 2019 |
Arnaud Darmont Memorial Best Paper
Arnaud Peizerat and G. Renaud (CEA-LETI) for their work titled "Correlated multiple sampling impact analysis on 1/f noise for image sensors." |
| 2018 |
Best Paper
Fei Wang and Albert Theuwissen (Technische University of Delft and Harvest Imaging) for their work on "Two calibration methods to improve the linearity of a CMOS image sensor." |
| 2018 |
Best Paper
Dietmar Wueller, Uwe Artmann, Vijay Rao, Guenter Reif, Joerg Kramer,and Fabian Knauf (Image Engineering GmbH & Co. KG and Vodafone Group Services GmbH) for their work titled "VCX: An industry initiative to create an objective camera module evaluation for mobile devices." |
| 2017 |
Best Paper
Laurent Alacoque, Sébastien Martin, Wilfried Rabaud, Édith Beigné, and Antoine Dupret (Université Grenoble Alpes and CEA) for their work on "A 128x128, 34um pitch, 8.9mW, 190mK NEDT, TECless Uncooled IR Bolometer image sensor with column-wise processing." |
| 2017 |
Best Paper
Noha El-Yamany (Intel Corporation) for his work on "Robust defect pixel detection and correction for Bayer imaging systems." |
| 2016 |
Best Paper
Grigorios Tsagkatakis, Murali Jayapala, Bert Geelen, and Panagiotis Tsakalides (FORTH, IMEC, and University of Crete) for their work titled "Non-negative matrix completion for the enhancement of snapshot mosaic multispectral imagery." |
| 2016 |
Best Paper
Subash M. Sridhar, Henry G. Dietz, and Paul S. Eberhart (University of Kentucky) for their work on "Use of flawed and ideal image pairs to drive filter creation by genetic programming." |
| 2016 |
Best Student Paper
Xiaoliang Ge (Technische Universiteit Delft) for her work titled "A comparative noise analysis and measurement for n-type and p-type pixels with CMS technique." |
| 2016 |
Best Student Paper
Yang Yang (University of Delaware) for his work on "Virtual DSLR: High quality dynamic depth-of-field synthesis on mobile platforms." |
2022 Committee
Conference Chairs
Jon S. McElvain, Dolby Labs, Inc. (United States)
Arnaud Peizerat, Commissariat à l’Énergie Atomique (France)
Nitin Sampat, Edmund Optics (United States)
Program Committee
Nick Bulitka, VIAVI Solutions (Canada)
Peter Catrysse, Stanford University (United States)
Calvin Chao, Taiwan Semiconductor Manufacturing Company (TSMC) (Taiwan)
Henry Dietz, University of Kentucky (United States)
Joyce E. Farrell, Stanford University (United States)
Boyd Fowler, OminVision Technologies (United States)
Eiichi Funatsu, OmniVision Technologies, Inc. (United States)
Sergio Goma, Qualcomm Technologies Inc. (United States)
Francisco Imai, Apple Inc. (United States)
Rihito Kuroda, Tohoku University (Japan)
Kevin Matherson, Microsoft Corporation (United States)
Hans Reyserhove, Ceremorphic (United States)
Jackson Roland, Apple Inc. (United States)
Min-Woong Seo, Samsung Electronics, Semiconductor R&D Center (Republic of Korea)
Gilles Sicard, Commissariat à l'Énergie Atomique (France)
Hari Tagat, Edmund Optics (United States)
Radka Tezaur, Intel Corporation (United States)
Jean-Michel Tualle, Université Paris 13 (France)
Dietmar Wueller, Image Engineering GmbH & Co. KG (Germany)