Important Dates

Call for Presentations
 » JIST-first Submission
1 March 2018
      (w/paper in proceedings)
 » Standard Submission
16 April 2018
      (w/paper in proceedings)
Final Manuscripts Due
5 July 2018
Hotel Reservations
28 July 2018
Early Registration Ends
26 August 2018
Conference Begins
23 September 2018

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Organic Semiconductors: From Vacuum Deposition to Printing

Karl Leo, Technische Universität Dresden (Germany)

Organic semiconductors consisting mostly of carbon are currently intensively investigated for electronic and optoelectronic applications. They offer key advantages, such as flexibility, easy recycling, low cost, and many more. In the first part of this talk, I will discuss some of the recent progress on devices such as highly efficient OLED, solar cells, transistors, and sensors and discuss the many novel applications these “soft” electronic devices” offer. In the second part, I will address manufacturing issues and discuss how the field of organic electronics will move from the current 
vacuum techniques to low-cost printing.

Printing Future Electronic Devices with Organic Semiconducting Materials

Mark James, Merck Chemicals Ltd. (UK)

Merck has been actively researching organic electronic materials since before 2000, with the objectives to develop products that enable mass production of electronic devices with new functionality not readily obtainable using existing silicon technologies. Multi-disciplinary innovation is required to develop many interrelated materials and processes in parallel to realize these step-change technologies. This talk discusses this process as well as the developement of solution processable and printable, functional material sets, covering the technologies of OLED, OTFT, OPV, and OPD.How the co-development of polymeric organic semiconductors, passive materials, and formulations with process optimisation enable the printing of high performance OTFT backplane arrays, with charge carrier mobility greater than 2 cm2/Vs, suitable for the mass production of printed flexible displays and sensors is also presented.


Electronic Skins Connecting Cyberspace and Human

Takao Someya, University of Tokyo (Japan)

Wearable electronics are expected to open up a new class of applications ranging from health-monitoring, motion-capturing, human-machine interfaces, and new IT fashion. In order to expand emerging applications of wearable technologies, printed flexible biomedical sensors have attracted much attention recently. To minimize the discomfort of wearing sensors, it is highly desirable to use soft electronic materials particularly for devices that come directly into contact with the skin and/or biological tissues. In this regard, electronics manufactured on thin polymeric films, elastomeric and textile substrates by printing are very attractive. This keynote reviews recent progresses of wearables and artificial electronic skins (E-skins) from the contexts of high-precision and long-term vital signal monitoring. Furthermore, the issues and the future prospect of wearables and beyond wearables is addressed. 

Advances in Additive Manufacturing: The Evolution of HP Inc.’s Jet Fusion™ 3D Printing Technology

David Claramunt, HP Inc. (US)

Recent advances and innovations in 3D printing, digital fabrication, and additive manufacturing methods are disrupting the way we design, develop, manufacture, and commercialize new technologies and products. These disruptions are enabling improved efficiencies on the manufacturing floor and in making the vision of mass customization a reality.  It is clear that the newest industrial revolution is already well underway.  The next phase of the revolution will extend beyond fit, form, and finish and will involve designing and engineering the functionality of the finished part by controlling the fundamental physical properties of the materials digitally, in real time, and at molecular and atomic scales. In this next phase, designers and engineers will be able to select and tune the physical properties of individual voxels as easily as geometric attributes. Leveraging decades of research and expertise in precision mechanics, microfluidics and materials sciences, HP has developed a 3D printing technology that achieves this level of control and is already reinventing the digital fabrication and manufacturing paradigms.  This presentation will provide an overview of the Jet Fusion™ technology, discuss how it has evolved since its introduction in 2016.  The presentation will conclude with a vision of how voxel-scale engineering will help to define the future of 3D printing, additive manufacturing, and digital fabrication. 

Industrial Applications of Inkjet Technologies

Rich Baker, Integrity Industrial Ink Jet Integration LLC (US)

Inkjet is a versatile, precision deposition process, that is increasingly finding utilization in industrial manufacturing of products. These usages range from traditional graphics, labels and date-coding, to more novel applications, such as, deposition of functional fluids (biological, pharmaceutical, electronic, etc.), 3D item fabrication, and the deposition of adhesives and coatings. Using his perspective as president and founder of one of the largest independent inkjet systems integrators in the United States, Baker highlights a few of these novel applications of inkjet, plus explore the challenges and barriers to implementation of inkjet into main stream manufacturing.

2018-2020 – The time to go industrial with Digital Packaging Production

Bernhard Schaaf, Heidelberger Druckmaschinen

Due to the automated collection and analysis of user data, the customer approach has become more segment-orientated. As a result, go to the next supermarket and you will see how the variation of products is almost exploding, which has a strong impact on shorter runs and faster production cycles.

We live in a world where the question is not any longer if digital is the answer for packaging printing. Today the question is how to build a profitable business with it, which technology to select strategically and what to take into 
account to succeed.

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